ICNEAClass
ICNEA 3973—Integrated circuit manufacturing
Class · Industrial Classification for National Economic Activities (GB/T 4754-2017) (GB/T 4754-2017)
Where 3973 sits
- C Manufacturing industry
- 39 Computer, communications and other electronic equipment manufacturing industry
- 397 Electronic device manufacturing
- 3973 Integrated circuit manufacturing
What 3973 includes
- Including manufacturing activities for the following integrated circuits:
- Integrated circuit discs: 12-inch integrated circuit discs, 8-inch integrated circuit discs, 6-inch integrated circuit discs, 5-inch integrated circuit discs, 4-inch integrated circuit discs, integrated circuit discs below 4 inches
- Integrated circuit packaging series: SOT (SOD) series, DIP series, SOP/SOJ series, PQFP series, BGA/PGA series, FlipChip series, CSP series, MCP series, other integrated circuit packaging series
- Integrated circuit finished products
- MOS micro devices: MOS_MPU micro devices, MOS_MCP micro devices, MOS_DSP micro devices
- Logic circuit: general purpose digital bipolar circuit, general purpose MOS logic circuit, gate array, field programmable logic gate array (FPGA)
- Memory: DRAM memory, SRAM memory, EPROM (rewritable read-only memory), Flash memory, other memory
- Analog circuit: amplifier circuit, interface circuit, voltage calibration circuit, digital/analog, analog/digital conversion circuit, comparator circuit, other analog circuits
- Special circuits: special circuits for consumer electronics, special circuits for computers and network equipment, special circuits for communications, special circuits for automotive electronics, special circuits for power management, and other special circuits
- Smart card chip and electronic tag chip: contact smart card chip, contactless smart card chip, reader circuit, other smart card chip and electronic tag chip
- Sensor circuit
- Microwave integrated circuits: microwave monolithic integrated circuits, other microwave integrated circuits
- Hybrid integrated circuits: thin-film hybrid integrated circuits, thick-film hybrid integrated circuits, microwave hybrid integrated circuits, and other hybrid integrated circuits
- Integrated circuit module
- Multi-chip package assembly (MCM)
- Refers to the manufacture of monolithic integrated circuits and hybrid integrated circuits.
3973 in other systems
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