ICNEAClass

ICNEA 3973Integrated circuit manufacturing

Class · Industrial Classification for National Economic Activities (GB/T 4754-2017) (GB/T 4754-2017)

Where 3973 sits

  1. C Manufacturing industry
  2. 39 Computer, communications and other electronic equipment manufacturing industry
  3. 397 Electronic device manufacturing
  4. 3973 Integrated circuit manufacturing

What 3973 includes

  • Including manufacturing activities for the following integrated circuits:
  • Integrated circuit discs: 12-inch integrated circuit discs, 8-inch integrated circuit discs, 6-inch integrated circuit discs, 5-inch integrated circuit discs, 4-inch integrated circuit discs, integrated circuit discs below 4 inches
  • Integrated circuit packaging series: SOT (SOD) series, DIP series, SOP/SOJ series, PQFP series, BGA/PGA series, FlipChip series, CSP series, MCP series, other integrated circuit packaging series
  • Integrated circuit finished products
  • MOS micro devices: MOS_MPU micro devices, MOS_MCP micro devices, MOS_DSP micro devices
  • Logic circuit: general purpose digital bipolar circuit, general purpose MOS logic circuit, gate array, field programmable logic gate array (FPGA)
  • Memory: DRAM memory, SRAM memory, EPROM (rewritable read-only memory), Flash memory, other memory
  • Analog circuit: amplifier circuit, interface circuit, voltage calibration circuit, digital/analog, analog/digital conversion circuit, comparator circuit, other analog circuits
  • Special circuits: special circuits for consumer electronics, special circuits for computers and network equipment, special circuits for communications, special circuits for automotive electronics, special circuits for power management, and other special circuits
  • Smart card chip and electronic tag chip: contact smart card chip, contactless smart card chip, reader circuit, other smart card chip and electronic tag chip
  • Sensor circuit
  • Microwave integrated circuits: microwave monolithic integrated circuits, other microwave integrated circuits
  • Hybrid integrated circuits: thin-film hybrid integrated circuits, thick-film hybrid integrated circuits, microwave hybrid integrated circuits, and other hybrid integrated circuits
  • Integrated circuit module
  • Multi-chip package assembly (MCM)
  • Refers to the manufacture of monolithic integrated circuits and hybrid integrated circuits.

3973 in other systems

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